Classification:
Prologue:
Epilogue:

Immersion Au will probably be too thin, and not provide a strong enough wire
bond joint.  The I-Au is porous.  Most wire bond is done with 30 microinches or
thicker Au.
---------------------- Forwarded by Jim Herard/Endicott/IBM on 03-20-97 11:56 AM
 ---------------------------

        TechNet-request @ ipc.ipc.org
        03-20-97 12:38 AM


To: Technet @ ipc.org@internet
cc:
Subject: Wire bonding

     To all technet users ,

     Currently we are having a discussion on the wire bonding with the
     ENIG , immersion gold process .I am interested to know the gold
     quality to enable to be applicable for wire bonding purpose .Any
     comments are highly welcome .Thanks .

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